R&D to NPI substrate engineering administration
Direct interface with distributors for brand new package deal substrate growth and qualification
Work with distributors on-site for engineering evaluations and NPI bother shootings
Touring in Asia is required
Training Particulars
MS Diploma or PhD in Chemical / Electrical / Mechanical / Supplies Engineering
Key
5+ years of expertise as a course of integration, manufacturing or R&D engineer in package deal substrate trade
In-depth information of substrate flip chip expertise
Acquainted with package deal course of & standards is most well-liked.
Distinctive expertise growth & challenge administration abilities
Sturdy communication & collaborative abilities
JobID: 113560696
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